| HDI PCB Technical Specification | |
| Layer | 1-40Layers |
| PCB Material | SY, ITEQ, KB, NOUYA |
| HDI Construction | 1+N+2+N+2, 3+N+3, 4+N+4, 5+N+5, 6+N+6, Anylayer |
| Constructio Ordinis | N+N、N+X+N、1+(N+X+N)+1 |
| Min Pattern Latitudo / Spacing | 2mil/2mil |
| Min Mechanica Dirlling Hole | 0.15mm |
| Min Crassitudo Core Board | 2mil |
| Laser Dirlling Hole | 0.075mm-0.1mm |
| Min Crassitudo PP | 2mil |
| Max Diameter Resinae Plug Hole | 0.4mm |
| Electroplating ad replendum foramina Locus | 3-5mil |
| Laser EXERCITATIO foramen Accuracy | 0.025mm |
| Min BGA Pad Centre Distantia | 0.3mm |
| Plating foramen implens Sag | ≤10um |
| Retro EXERCITATIO / counterink foramen TOLERATIO | ±0.05mm |
| Per foramen Plating Penetration Capacity | 16:1 |
| Caeca foramen Plating Penetration Capacity | 1.2:1 |
| BGA Min PAD | 0.2mil |
| Min Buried foramen (Mechanical Dirlling foramen) | 0.2mil |
| Min Buried foramen (Laser Dirlling foramen) | 0.1mil |
| Min cæcum foramen (Laser Dilling foramen) | 0.1mil |
| Min cæcum foramen (Mechanical Dilling Hole) | 0.2mil |
| Min Spacing Inter Laser Caecus Hole et Mechanica Buried Hole | 0.2mil |
| Min Laser Dirlling Hole | 0.10(depth≤55um), 0.13(depth≤100um) |
| Interlaminaris Gratia diei et noctis | ±0.05mm(±0.002") |
| Interiorem sarcina | Vacuum sarcina, Plastic bag |
| Exterior sarcina | Latin carton sarcina |
| Vexillum/Certificatorium | ISO9001, ISO14001, IATF 16949, ISO 13485, ROHS, CQC, ANSI/ESD, IPC-A-610, IPC-A-620 |
| Profiling Punching | Fusus, V-CUT, Beveling, Chamfer |
