Rigid-flex PCB Technical SpecificationLayer1-8 layersFinish Board Thickness0.25-6.0mmMin Pattern Latitudo / Spacing0.05mm/0.05mmMax Finish Tabula Size230*450mmFinish Tabula Crassitudo Tolerantia±50.05mmPP Crassitudo 12.5um/25um/50umCopper Crassitudo MaterailFR4/PI/PET/SUS/PSASurface TreatmentENIG/Immersionem Tin/OSP/Immissio Argentea/Plating GoldMin Mechanica Dirlling Hole0.15mmMin Laser Dirlling Hole0.1mmHole ToleranceNPTH:±0.05mm PTH:±0.075mmCover Film ColorYellow/BlackPI/2mil/0. Magnitudo5*8mmMin PadInner layer: 5mil Stratum externum: 4milStiffener Min Size4×5mmStiffener Max Size32×32mmStifferner Alignment Accuracy±0.075mmCover Min apertura sizeSteeling Tooling: 0.6×0.6mm Subtilitas Tooling: 0.5×0.5mmMin Aperiens: Instrumentum: 0.50.5mmMin Aperiens: Instrumentum Operis: 0.5mm Normaling Routing: Instrumentorum 0.15mmCoating Film Overflow AmountUnilateralNormal: 0.08-0.12mm Limitatio: 0.03mmPeel-off Strength1.4NPlanenessBefore coquendo<15um Post coquendum<30umThermal Shock288℃ (3 times intra 10 seconds) W/B Filum Aurum excute> 6gMin.Board/Yersm: . 0.6mm/ 10Layers: 0.8mmInner packingVacuum sarcina, Plastic bagOuter packingStandard carton packingStandard/ Certificatorium ISO9001, ISO14001, IATF 16949, ISO 13485, ROHS, CQC, ANSI/ESD, IPC-A-610, IPC-A-620 Profiling V-CUT
