| IC Substrate PCB Technical Specification |
| Layer | 1-16 Stratis |
| Min Exemplum Locus | 25um |
| Min Pattern Space | 25um |
| Min Pad | 80um |
| Min BGA Centre Space | 250um |
| Min Crassitudo/Core/PP Crassitudo (um) | 2L: 80/30 |
| 4L: 200/50/20 |
| 6L: 240/50/20 |
| 8L: 330/50/20 |
| Color larva venundatus | Viridis, Niger |
| Solder Resis | EG23A, AUS308, AUS320, AUS410 |
| Superficiem Perago / Curatio | Aurum molle Plating, durum Aurum Plating, ENIG,OSP |
| Planities(um) | 5max |
| Min. Laser Dirrlled foramen Locus (um) | 50 |
| Interiorem sarcina | Vacuum sarcina, Plastic bag |
| Exterior sarcina | Latin carton sarcina |
| Vexillum/Certificatorium | ISO9001, ISO14001, IATF 16949, ISO 13485, ROHS, CQC, ANSI/ESD, IPC-A-610, IPC-A-620 |
| Profiling Punching | Fusus, V-CUT, Beveling, Chamfer |
