Materia Part
1. Component | 2. Solder crustulum |
> uBGA/QFN/QFP | > Duc gratis & Halogen gratis |
BGA pila diameter: 0.12mm~ | > Non-mundans crustulum solidatorium |
BGA pice: 0.35mm ～ 1.27mm | > Low termperature solidaturae crustulum |
QFN/OFP picis tenuis: 0.35mm~ | > Aqua solutum solidaturum crustulum |
> 01005 chip component |
|
> 0dd component |
